About Us

Start of business with assembly of wireless devices and vacuum tube radios
In 1939, we began operation in Asahi-ku, Osaka as a subcontracting plant of Matsushita Electric (now Panasonic) to assemble wireless devices, radios and their parts. “Taiyo Manufacturing,” the current company name, was named by an executive of Matsushita Electric during that period.

Development in the period of rapid economic growth
In the postwar reconstruction period, we started to plate radio parts in technical cooperation with plating companies, and initiated plating business on a full scale with zinc plating. Our company was reorganized into a limited company in 1953.

Development in the period of rapid economic growth
During the period of rapid economic growth, when home electric appliances became widespread at a tremendous rate, we introduced new plating technology and achieved development. While the popularization of audio products led to growing demand for their parts, we successfully replaced aluminum decoration rings with plastic plated knobs, and accelerated introduction of Plastic Plating into AV products with development of electroformed molds.

Keeping up with the trend of preferring lighter and smaller electronic devices
We had gold plated terminals of Electronic Circuit Boards since the late 1960s. Thus, we have traditionally focused on the plating of Electronic Circuit Boards. Around 1975, with a strong trend of preferring lighter and smaller electronic devices, we saw a rapidly growing demand for through-hole plating along with double-sided and multilayer Electronic Circuit Boards. We established a production system with eight lines by 1990 to be a major through-hole plating manufacturer in Japan. Starting with the establishment of Taiyo Technology of America in 1991, we also accelerated overseas operations around that time.

Coming of digital age
From 1990, electronic devices experienced a wave of digitalization. Taking advantage of the wave, we promoted development of bump plating and other cutting-edge plating technologies, and started mass production. Although demand for Plastic Plating was temporarily sluggish, it then began to be adopted for buttons of mobile phones, which started to be widespread at that time, at an explosive rate from around 1995. We also developed nickel-free plated buttons during the period.

Development from core plating technology to a “one-stop” order system and car electronics
With Plastic Plating, we advanced into the field of on-vehicle equipment on a full scale around 2010. We are applying our original satin-finished plating to interior parts for market deployment. In the electronic area, we have actively introduced seed film forming technology and resist patterning technology, expanded operations by putting plating technology at the core and additionally handling preceding and following processes and made efforts to allow customers to place a “one-stop” order for the whole processes. We aim to establish “total process” involving wafers, Electronic Circuit Boards and ceramic boards.